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Bluetooth^®LE

Introduced in Bluetooth^® 4.0, Bluetooth^® LE prioritizes ultra-low power efficiency and is ideal for applications demanding minimal, infrequent data transfers. Since 2014, Telink’s Bluetooth^® LE SoCs and SDKs have driven the global deployment of billions of IoT devices, delivering reliable performance and effortless interoperability.

TL322x Series

NEW

TL322x series SoC is compatible with a variety of mainstream wireless communication standards and industrial alliance specifications, including Bluetooth LE, Zigbee, RF4CE, Thread, Matter, and 2.4GHz proprietary protocols. By integrating multi-protocol functions into a single chip, the TL322x series brings advantages such as multi-protocol compatibility, cross-ecosystem interconnection, and high-efficiency performance to wireless IoT devices, making it an ideal choice for high-performance wireless IoT.

Product Selection Tool

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Part Number	Type	Datasheet	Protocol	MCU	SRAM	NVM	GPIO	Size（mm）	RoHS	Reliability	Composition	Errata	Purchase
TL3228AE11T80R	SoC		Bluetooth 6.0	Dual Core, RISC-V 32-bit	384KB	2560KB	64	QFN80, 9x9
TL3228AE10T80R	SoC		Bluetooth 6.0	Dual Core, RISC-V 32-bit	256KB	1536KB	64	QFN80, 9x9
TL3228BE11T56R	SoC		Bluetooth 6.0	Dual Core, RISC-V 32-bit	384KB	2560KB	40	QFN56, 7x7
TL3228BE10T56R	SoC		Bluetooth 6.0	Dual Core, RISC-V 32-bit	256KB	1536KB	40	QFN56, 7x7
TL3228B0E10T56R	SoC		Bluetooth 6.0	Dual Core, RISC-V 32-bit	256KB	1024KB	40	QFN56, 7x7
TL3228CE11T40R	SoC		Bluetooth 6.0	Dual Core, RISC-V 32-bit	384KB	2560KB	22	QFN40, 5x4
TL3228C0E10T40R	SoC		Bluetooth 6.0	Dual Core, RISC-V 32-bit	256KB	1024KB	22	QFN40, 5x4
TL3228CE09T40R	SoC		Bluetooth 6.0	Dual Core, RISC-V 32-bit	384KB	512KB	22	QFN40, 5x4
TL3228WE09W59R	SoC		Bluetooth 6.0	Dual Core, RISC-V 32-bit	384KB	512KB	33	WLCSP59 3.28x2.65
TL3828AE10T80R	SoC		Bluetooth 6.0	Dual Core, RISC-V 32-bit	256KB	1536KB	64	QFN80, 9x9
TL3828BE10T56R	SoC		Bluetooth 6.0	Dual Core, RISC-V 32-bit	256KB	1536KB	40	QFN56, 7x7

Software

Hardware

Software

Telink provides a complete SDK to help you develop and build IoT smart devices, which covers your entire product life cycle, from development to OTA maintenance. The Telink SDK always includes the latest technology protocols and provides secure and stable connectivity, which, combined with Telink IoT Studio integrated development tools, can help quickly achieve mass production.

Telink loT Studio

Telink loT Studio is an integrated development environment designed specifically for Telink chips. It supports firmware compilation, firmware download, and development debugging.

Windows

Linux

SDK Name	Supported Chip	SDK Version	Download SDK	SDK Handbook
Bluetooth^® LE Multi Connection	TL322x	V4.0.4.6	Github
Platform	TL322x	V3.10.0	Github

Hardware

Provide complete hardware guideline and reference design to build various device forms based on the Telink hardware development platform.

Picture	Product Name	Description	User Manual	Design Guideline	Design File	Buy Now
	TL322X EV-board	The TL322X EV-board is designed based on the TL322X chip and and is used to verify the TL3228X/3828X series chips and supports various functional tests.	Download	Download	Download

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